JPS6355546U - - Google Patents
Info
- Publication number
- JPS6355546U JPS6355546U JP15024586U JP15024586U JPS6355546U JP S6355546 U JPS6355546 U JP S6355546U JP 15024586 U JP15024586 U JP 15024586U JP 15024586 U JP15024586 U JP 15024586U JP S6355546 U JPS6355546 U JP S6355546U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- resin
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15024586U JPS6355546U (en]) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15024586U JPS6355546U (en]) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355546U true JPS6355546U (en]) | 1988-04-14 |
Family
ID=31066213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15024586U Pending JPS6355546U (en]) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355546U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496991A (zh) * | 2020-11-12 | 2022-05-13 | 三菱电机株式会社 | 半导体装置 |
-
1986
- 1986-09-29 JP JP15024586U patent/JPS6355546U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496991A (zh) * | 2020-11-12 | 2022-05-13 | 三菱电机株式会社 | 半导体装置 |
| JP2022077594A (ja) * | 2020-11-12 | 2022-05-24 | 三菱電機株式会社 | 半導体装置 |
| US12119279B2 (en) | 2020-11-12 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device having at least one resin part that closes one or more corresponding ones of a plurality of threaded holes |